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China High-Precision Asm Semiconductor Machine Asmpt Idealab 3G LED Packaging Equipment
US$100,000.00-1,000,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
24h OnlineFunction
High Temperature ResistanceModel NO.
IDEALab 3GDemoulding
AutomaticCondition
NewCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1 SetQuality
100% TestedAdaptation
Packaging EquipmentInventory
AvailableTransport Package
Plastic Bag&Carton BoxSpecification
2100 KGTrademark
asmOrigin
USAHS Code
8479896200Production Capacity
500PCS/YearKey features
Tailored for LED packaging, offering a full process solution from die bonding to testing.
Adopts high-precision die bonding tech to meet strict Mini/Micro LED requirements.
Equipped with innovative vision systems for micron-level precise die recognition.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.54h
About Our Factory & Business Background
AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5
Our Production Capability & Technical Expertise
Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What products can you provide?
A:
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is your MOQ?
A:
Yes, the sample is available. Our Minimum Order Quantity (MOQ) is 1 piece.
Q:How long will it take to deliver the goods?
A:
About 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
We have besi,asm, disco, etc.
Q:What is the warranty of the machine?
A:
We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.
Send Inquiry
*To:
Guangdong Xinling Industrial Co., Ltd
Guangdong Xinling Industrial Co., Ltd*Content:
Supplier replies will be sent to your registered email
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