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China Versatile Semiconductor Measuring Instrument Tbp CT 1500 M&I Equipment
US$336,000.00-756,000.00
1 set

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold

Model NO.

TBP CT 1500

Demoulding

Automatic

Condition

Used

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

>1,000,000 Shots

Delivery

1-7 Days

MOQ

1 PC

Quality

100% Tested

Adaptation

M&I Equipment

Inventory

Availability

Transport Package

Carton Box and Plastic Bag

Specification

2800*2000*2000

Trademark

TBP

Origin

Japan

HS Code

8479909090

Production Capacity

500PCS/Year

Key features

High-speed automated sorting with a robust mechanical handling system.
Seamless interface with standard semiconductor ATE testers.
Handles diverse package types including QFN, SOP, and BGA devices.

Company profile

Guangdong Xinling Industrial Co., Ltd
In-stock CapacityOEM ServicesOverseas ServicesSelf-branded
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.61h

About Our Factory & Business Background

AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5

Our Production Capability & Technical Expertise

Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:1. What products can you provide?
A:
We can provide Gelatinize machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines,oxidation/diffusion/annealing equipment, also known as heat treatment equipment
Q:2. The functions of the M&I equipment
A:
The system operates under computer control, using an SMU (Source/Measure Unit) to apply voltage or current to the device and monitor its response. A switching matrix routes signals to the DUT pins contacted by the probe station, while a CMU (Capacitance Measurement Unit) performs 1 MHz capacitance/conductance measurements to acquire electrical parameters.
Q:3. The principle of the M&I equipment ?
A:
Designed for semiconductor process control monitoring (PCM) and device characterization, the system measures DC voltage/current as well as 1 MHz capacitance/conductance. It supports high-resolution measurements down to 20 fA for current, 4 UV for voltage, and 1 fF for capacitance covers ranges up to 200 V ,1 A, and enables the parallel execution of up to eight tests.
Q:4. The application scope of the M&I equipment ?
A:
As an industry de facto standard, it is adopted by most semiconductor manufacturers worldwide. It is primarily used for process monitoring and development in integrated circuit manufacturing. It can test on-wafer devices, discrete devices, and packaged devices for parameter quality inspection, online anomaly feedback, and failure root cause analysis.
Q:5. What are the technical challenges of a M&I equipment ?
A:
Key challenges include: meeting the more rigorous demands placed on C-V analysis by advanced MOS processes; ensuring high-precision, low-noise measurements across the entire 96-pin switch matrix; achieving high throughput while maintaining measurement accuracy for minute currents at the 20 fA level; and coordinating system integration with probe station control.

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