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China Versatile Semiconductor Measuring Instrument Tbp CT 1500 M&I Equipment
US$336,000.00-756,000.00
1 set
Product profile
Customization
AvailableAfter-sales Service
24 Hrs OnlineFunction
Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-ColdModel NO.
TBP CT 1500Demoulding
AutomaticCondition
UsedCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
>1,000,000 ShotsDelivery
1-7 DaysMOQ
1 PCQuality
100% TestedAdaptation
M&I EquipmentInventory
AvailabilityTransport Package
Carton Box and Plastic BagSpecification
2800*2000*2000Trademark
TBPOrigin
JapanHS Code
8479909090Production Capacity
500PCS/YearKey features
High-speed automated sorting with a robust mechanical handling system.
Seamless interface with standard semiconductor ATE testers.
Handles diverse package types including QFN, SOP, and BGA devices.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.61h
About Our Factory & Business Background
AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5
Our Production Capability & Technical Expertise
Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:1. What products can you provide?
A:
We can provide Gelatinize machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines,oxidation/diffusion/annealing equipment, also known as heat treatment equipment
Q:2. The functions of the M&I equipment
A:
The system operates under computer control, using an SMU (Source/Measure Unit) to apply voltage or current to the device and monitor its response. A switching matrix routes signals to the DUT pins contacted by the probe station, while a CMU (Capacitance Measurement Unit) performs 1 MHz capacitance/conductance measurements to acquire electrical parameters.
Q:3. The principle of the M&I equipment ?
A:
Designed for semiconductor process control monitoring (PCM) and device characterization, the system measures DC voltage/current as well as 1 MHz capacitance/conductance. It supports high-resolution measurements down to 20 fA for current, 4 UV for voltage, and 1 fF for capacitance covers ranges up to 200 V ,1 A, and enables the parallel execution of up to eight tests.
Q:4. The application scope of the M&I equipment ?
A:
As an industry de facto standard, it is adopted by most semiconductor manufacturers worldwide. It is primarily used for process monitoring and development in integrated circuit manufacturing. It can test on-wafer devices, discrete devices, and packaged devices for parameter quality inspection, online anomaly feedback, and failure root cause analysis.
Q:5. What are the technical challenges of a M&I equipment ?
A:
Key challenges include: meeting the more rigorous demands placed on C-V analysis by advanced MOS processes; ensuring high-precision, low-noise measurements across the entire 96-pin switch matrix; achieving high throughput while maintaining measurement accuracy for minute currents at the 20 fA level; and coordinating system integration with probe station control.
Send Inquiry
*To:
Guangdong Xinling Industrial Co., Ltd
Guangdong Xinling Industrial Co., Ltd*Content:
Supplier replies will be sent to your registered email
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