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Advanced 2D and 3D Optical Measurement System for Wafers

Name: Advanced 2D and 3D Optical Measurement System for Wafers
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2153395922

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00

1 Piece

Product profile

Customization

Available

Power

220V AC, 3 Kw

Wafer Support

4 to 12 Inch Wafers

Model NO.

JC-260420

Uph

up to 90 Wafers Per Hour

Detection Rate

>95%

Repeatability

<3%

Automatic

Fully Automatic Loading/Unloading

Transport Package

Ippc Standard Pack

Specification

1800 mm × 1200 mm × 1700 mm

Trademark

Himalaya

Origin

China

Production Capacity

Key features

Sub-Micron Precision: Achieves 0.55um/pixel resolution with sub-micron accuracy for 2D/3D inspection.

High Throughput: Processes up to 90 wafers per hour, designed for high-volume production.

Advanced Detection: Detects defects down to 60 nm using multi-laser darkfield scattering technology.

Fully Automatic: Features EFEM with dual-arm robot for fully automatic loading and unloading.

Wide Compatibility: Supports 4 to 12 inch wafers including Si, SiC, GaAs, and Sapphire.

AI Integration: Integrates traditional algorithms with AI for enhanced defect identification.

High Reliability: Ensures detection rate >95% and repeatability <3% for stable operation.

Flexible Customization: Offers flexible customization options for OEM and ODM requirements.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:What is the HM RO-20 wafer defect inspection machine used for?

It is a pattern-less wafer surface defect inspection equipment for real-time detection of particles, scratches, and haze on bare wafers, dielectric films, and epitaxial layers. Ideal for semiconductor manufacturing in China & global fabs.

Q:What wafer sizes and sensitivity does HM RO-20 support?

Supports 4-12 inch wafers (Si, SiC, GaN, GaAs, Sapphire). Minimum detection sensitivity: 60 nm PSL@Si, meeting advanced semiconductor process requirements in China.

Q:What is the throughput of HM RO-20 inspection equipment?

High throughput: 90 WPH (8-inch HT) / 70 WPH (12-inch HT). Designed for high-volume production in Chinese wafer fabs & SiC/GaN factories.

Q:What are the key accuracy and stability indicators?

Detection rate >95%, repeatability <3%, CV value as low as 0.32%. Stable and reliable for long-term use in China cleanrooms.

Q:What is the minimum order quantity?

The minimum order quantity is 1 Set.