SourcingAI
Try for free
Powered by Made-in-China.com
Advanced Workflow Lamination and Encapsulation System for Efficiency
US$800,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

Feature 1

High Precision

Feature 2

High Efficiency

Model NO.

HM-005

Tact Time

≤30s/Module

Material Changeover

≤3min

Positioning Accuracy

Start/End Points: <1mm; Path Straightness: <0.8mm

Overlap Accuracy

≤0.2mm (Dual-Camera Vision + Ai Correction)

Equipment Dimensions

9200×2000×2000mm

Thermo-Compression

100°C/0.5MPa

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High Precision Positioning: Starting and ending points accuracy <1mm with path straightness <0.8mm.
Comprehensive Lamination Process: Handles butyl adhesive, busbar tape, and film covering for all four sides.
Flexible Customization: Offers OEM, ODM, and design services with flexible customization options.
Wide Module Compatibility: Suitable for Perovskite single-junction and 2T/4T tandem modules up to 400mm.
Global Export Experience: Serving over 200 customers and suppliers in 30+ countries since 2019.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.66h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
0/4000

Supplier replies will be sent to your registered email

You may also like

Advanced PVD Deposition System for High-Quality Film Coatings
Made-in-China.com