Do you offer OEM or ODM services?

Yes, we provide flexible customization with both OEM and ODM services available.

What are the main application fields?

The machine is applicable for Detector, Diode, Power Electronic Components, and IGBT manufacturing.

Advanced Automatic Wafer Placement System for Precision Manufacturing

Name: Advanced Automatic Wafer Placement System for Precision Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1972927771

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

Application

Detector, Diode, Power Electronic Components, IGBT

Batch Number

2023+

Model NO.

HMLA-650

Certification

CCC, CE, EPA

Manufacturing Technology

Logic IC

Material

Power Semiconductor

Model

Hmla-Ion500

Package

CSP

Signal Processing

Digital

Placement Angle

Chip Size >3mm *3mm ± 0.5° @3o Chip PLA

Board Size Range

X×Y:600mm×600mm

Chip Size Range

Length X Width: 1 X 1 mm to 20 X 20 mm

Chip Thickness

0.05mm~1mm

Wafers

6-12 Inch

Transport Package

Wooden Package

Specification

0*0*0

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Modular Customization: Modular design allows customization according to different production processes.

Wide Wafer Compatibility: Supports 6-12 inch wafers with automatic wafer expansion system.

Advanced Vision System: Equipped with high-resolution CCD, telecentric lens, and programmable LED light source.

Robust Structural Design: High-strength steel frame, precision castings, and marble platform ensure rigidity.

Flexible Chip Handling: Handles chip sizes from 1x1mm to 20x20mm with automatic angle correction.

Comprehensive Safety Features: Includes vacuum crystal leakage detection and re-picking functions.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.15h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.

Q:What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

Q:What is the lead time for delivery?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.