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Advanced Automatic Wire Bonder for Gold and Copper Bonding
US$60,000.00-170,000.00
1 Box
Product profile
Customization
AvailableAfter-sales Service
We HaveDemoulding
Pull CoreCondition
NewCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
PneumaticMould Life
>1,000,000 ShotsOnline Technical Guidance
Once Every MonthVisit The Production and Use of Customer
2-4 Times/YearInvite Customer Technical Personnel to S
2 Opportunities Per YearIntroduction of Domestic Advanced Techno
Every Year, We Will Share The Technical Updates ofTransport Package
International Trade StandardSpecification
985mm*960mm*1770mmTrademark
HimalayaOrigin
ChinaHS Code
8486402200Key features
High Speed Automatic Bonding: Features new servo system for faster response, higher accuracy, and higher UPH.
Advanced Optical Inspection: Includes new zoom lens and high precision post weld inspection (PBI) function.
Wide Material Compatibility: Supports wire diameters from 15 to 50 microns and various IC packages like BGA and QFP.
Comprehensive Certifications: Certified with CCC, PSE, FDA, RoHS, ISO, and CE standards for global compliance.
Intelligent Calibration: Features intelligent detection prompting timely calibration and advanced bonding force calibration.
Long Mould Life: Designed for durability with a mould life exceeding 1,000,000 shots.
Flexible Customization: Offers flexible customization options including OEM and ODM services.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What are the main products offered?
A:
Main products include Die Bonder, Wire Bonding, Laser Marking, Laser Grooving, Laser Cutting, and Automatic Silicone Dispensing Equipment.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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