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Advanced Ceramic Laser Dicing System with CCD Imaging Technology
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsDriven Type
PneumaticProduct Name
Ceramic Laser Drilling/DicingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Multi-Laser Wavelengths: Supports 1064nm, 532nm, and 355nm lasers for diverse material processing needs.
CCD Visual Guidance: Integrated multi-feature CCD visual positioning ensures precise alignment and operation.
Versatile Material Processing: Capable of precision drilling, cutting, and scribing for alumina, silicon nitride, and zirconium oxide.
High Efficiency Output: Achieves UPH of 50+ plates per hour with stable and reliable high peak power fiber laser.
Customizable Configuration: Offers single or double head options with manual or automatic loading and unloading modes.
Patented Technology: Utilizes patented laser waveform segmentation editing technology for enhanced performance.
Comprehensive Warranty: Provides a 12-month warranty with 24-hour online professional technical support.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What materials can this machine process?
A:
It supports precision drilling, cutting, and scribing of alumina, aluminium nitride, zirconium oxide, and silicon nitride.
Q:What laser wavelengths are available?
A:
The system supports laser wavelengths of 1064nm, 532nm, and 355nm.
Q:What is the warranty period?
A:
We provide a one-year warranty and 24-hour online professional technical support.
Q:How to choose a suitable machine?
A:
Please provide the working piece material, size, and functional requirements. We will recommend the most suitable machine based on our experience.
Q:Is customization available?
A:
Yes, we offer customized solutions including single/double head configurations and manual/automatic loading options.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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