What payment terms are accepted?

We accept LC, T/T, PayPal, and Western Union.

Is customization available for this equipment?

Yes, flexible customization is available including OEM and ODM services.

Advanced Modular Laser Annealing System for Sic Technologies

Name: Advanced Modular Laser Annealing System for Sic Technologies
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2122821535

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-300,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Function

High Temperature Resistance

Model NO.

LAM-01

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

Semiconductor Equipment

Feature 1

High Precision

Feature 2

High Efficiency

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Modular Design Compatibility: Supports 4, 6, and 8-inch thin chip wafers with flexible integration.

Advanced Laser Technology: Self-developed laser shaping ensures uniform and stable spot energy.

High Precision Annealing: Produces uniform, flat surfaces with excellent electrical properties.

Strict Process Control: Controls oxygen content and carbon precipitation for minimized defects.

SEMI Standard Compliance: Equipped with EFEM system supporting SECS-GEM communication.

Comprehensive Warranty: 12-month warranty coverage with 24-hour online technical support.

Flexible Customization: Offers OEM, ODM, and design services for tailored solutions.

High Mould Life: Durable mould life ranging from 300,000 to 1,000,000 shots.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.00h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What wafer sizes does the machine support?

The machine supports 4, 6, and 8-inch thin chip SiC wafers with a modular design.

Q:What is the lead time for orders?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.