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Advanced High-Precision UV Laser Cutter for Mobile Devices
US$10,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
CUT-01Application
Automotive IndustryCooling System
Air CoolingTechnical Class
Continuous Wave LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingCondition
NewProduct Name
Automatic Laser CuttingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High-Precision UV Laser: 355nm wavelength with small heat-affected zone for efficient PCBA processing.
Advanced CCD Positioning: 5MP camera system ensures high-precision product alignment and processing.
Smart Control Software: Features automatic focusing, distortion compensation, and multi-board cutting.
Versatile Material Support: Suitable for FPCBA, PCBA, PI, FR4, FR5, CEM, and other electronic materials.
Flexible Customization: Customized according to needs with OEM/ODM services available.
Reliable After-Sales Support: One-year warranty with 24-hour online professional technical support.
Compact Gantry Structure: Gantry type structure with 300x300mm max processing area.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.71h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum line width achievable?
A:
The minimum line width is 0.03mm, ensuring high-precision cutting.
Q:What materials can this laser cutter process?
A:
It is suitable for FPCBA, PCBA, RF, CVL, SIP, coverlay, PI, FR4, FR5, and CEM materials.
Q:What is the maximum processing area?
A:
The max processing area is 300mm*300mm.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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