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Advanced High-Precision UV Laser Cutter for Mobile Devices
US$10,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

Provided

Model NO.

CUT-01

Application

Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Metal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Condition

New

Product Name

Automatic Laser Cutting

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High-Precision UV Laser: 355nm wavelength with small heat-affected zone for efficient PCBA processing.
Advanced CCD Positioning: 5MP camera system ensures high-precision product alignment and processing.
Smart Control Software: Features automatic focusing, distortion compensation, and multi-board cutting.
Versatile Material Support: Suitable for FPCBA, PCBA, PI, FR4, FR5, CEM, and other electronic materials.
Flexible Customization: Customized according to needs with OEM/ODM services available.
Reliable After-Sales Support: One-year warranty with 24-hour online professional technical support.
Compact Gantry Structure: Gantry type structure with 300x300mm max processing area.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.71h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum line width achievable?
A:
The minimum line width is 0.03mm, ensuring high-precision cutting.
Q:What materials can this laser cutter process?
A:
It is suitable for FPCBA, PCBA, RF, CVL, SIP, coverlay, PI, FR4, FR5, and CEM materials.
Q:What is the maximum processing area?
A:
The max processing area is 300mm*300mm.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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