Advanced High Precision Wafer Identification and Secure Storage Solution

Name: Advanced High Precision Wafer Identification and Secure Storage Solution
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2026539312

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-200,000.00

1 Set

Product profile

Customization

Available

After-sales Service

12 Months

Function

High Temperature Resistance

Model NO.

Himalaya-16

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Leakage Rate

≤0.5%

Inspection Rate

≤3%

2X Lens

Defect ≥9.7um

Incoming Wafer Size

8-Inch (200mm Diameter)

Yield Repeatability

<±0.05% (for Non-Abnormal Wafers ≥95%

Wafer Detection Area

Selectable (Supports Roi)

Wafer Size

Adjustable

Foup ID

Automatic Reading, Box Opening & Mapping Scan

Xyz Table

Software-Controlled Interface

Transport Package

Wooden Pack

Specification

Customized

Trademark

Himalaya

Origin

China

Production Capacity

11111

Key features

Automatic FOUP ID Reading: Automatically reads FOUP ID, opens box, and performs mapping scan for efficient workflow.

Adjustable Wafer Size Support: Supports incoming wafer sizes of 8-inch (200mm) and 12-inch (300mm) diameters.

Comprehensive Data Output: Displays real-time yield, defect distribution, and exports data/archives in TXT format.

Flexible Customization Options: Offers flexible customization for leakage rate, inspection rate, lens specs, and wafer size.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What wafer sizes are supported?

The system supports incoming wafer sizes of 8-inch (200mm diameter) and 12-inch (300mm diameter).

Q:What customization options are available?

We offer flexible customization for leakage rate, inspection rate, lens specifications, and wafer size.

Q:What data output features are included?

Features include real-time yield display, defect data per region, data archiving, and die mapping export in TXT format.