What is the heating table temperature range?

The maximum temperature of the heating table is up to 200 degrees Celsius.

What is the ultrasonic power range?

The ultrasonic power ranges from 0 to 10 Watts.

What are the main application areas?

It is widely used in the manufacturing of semiconductor devices, hybrid circuits, microwave devices, and components.

Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing

Name: Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2073739452

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-200,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

12 Months

Model NO.

HM001

Max Cavity Depth

10 mm

Heating Table Temperature

up to 200°C

Ultrasonic Power

0 To10 W

Transducer Frequency

98 ± 3 kHz

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

High Bonding Efficiency: Achieves 1.2 seconds per line bonding speed with high precision and consistency.

Full Process Visualization: Features machine vision teaching, programming, and online monitoring of welding quality.

Precise Pressure Control: Bonding pressure is precisely controlled within the range of 5GF to 150GF.

Wide Wire Compatibility: Supports multiple types of solderable gold wires with diameters from 18 to 50 micrometers.

Customizable Cavity Depth: Maximum cavity depth can be customized up to 10 mm.

High Temperature Capability: Heating table temperature can reach up to 200 degrees Celsius.

Flexible Customization: Offers flexible customization options including OEM and ODM services.

Comprehensive Warranty: Includes a 12-month warranty with 24-hour online professional technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What is the bonding speed?

The bonding speed is approximately 1.2 seconds per line, depending on the product situation.

Q:What is the maximum cavity depth?

The maximum cavity depth is 10 mm.