What is the minimum order quantity?

The minimum order quantity is 1 set.

What are the payment terms?

Payment terms include LC, T/T, PayPal, and Western Union.

What is the lead time for production?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.

Advanced Laser Debonding System with Real-Time Monitoring Features

Name: Advanced Laser Debonding System with Real-Time Monitoring Features
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2120465195

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

Condition

New

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Laser Debonding

Feature 1

Stripping and Cleaning Functions

Feature 2

Real-Time Monitoring

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Real-Time Monitoring: Ensures process stability with automatic compensation during laser debonding.

High Efficiency Beam: Square top hat beam design for high debonding efficiency and low thermal damage.

Flexible Customization: OEM and ODM services available with flexible customization options.

Multi-Wavelength Support: Supports 355nm and 1340nm wavelengths for various wafer processing needs.

Wide Wafer Compatibility: Compatible with 6, 8, and 12-inch wafers for carrier substrate re-use.

Professional Technical Support: 24 hours online professional technical support provided with the equipment.

100% Quality Inspection: Finished products undergo 100% visual and function inspection before shipping.

Global Service Network: Equipment exported to over 30 countries with a vast customer base.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What are the laser wavelengths available?

The system supports 355nm and 1340nm wavelengths.

Q:What wafer sizes are supported?

The machine supports 6 inch, 8 inch, and 12 inch wafers.

Q:Is OEM or ODM service available?

Yes, OEM and ODM services are provided with flexible customization options.