Advanced Laser Debonding Technology for Semiconductor Wafer Cleaning

Name: Advanced Laser Debonding Technology for Semiconductor Wafer Cleaning
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2123743765

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

1 Years

Function

Abrasion Resistance, High Temperature Resistance

Model NO.

LDM-01

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

Laser Debonding

Feature 1

Stripping and Cleaning Functions

Feature 2

Real-Time Monitoring

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

All-in-One Process Integration

Square Top Hat Beam for Superior Thermal Control

Active Process Stabilization

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:Why is a square top hat beam better than a Gaussian beam for wafer debonding?

A square top hat beam provides uniform energy density across the entire scanned area, avoiding hot spots that can crack ultra-thin wafers. It also maximizes debonding efficiency by matching the typical rectangular scan pattern used in production tools.

Q:What adhesive types are compatible with this system?

The system is designed for use with wavelength-matching temporary bonding adhesives (provided or specified by the supplier). Both 355nm and 1340nm laser options are available to suit different adhesive absorption characteristics.

Q:How long does it take to debond a full 12-inch wafer?

Typical laser scan time is approximately 100 seconds per 12-inch wafer, excluding handling and cleaning steps. This supports high-volume manufacturing with fast cycle times.