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Advanced Sic Laser Annealing System for Micro LED Manufacturing
US$50,000.00-70,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Function

Lubrication, High Temperature Resistance, Anti-Corrosion

Model NO.

LLO-0116

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Product Name

Laser Annealing Equipment Semiconductor

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

High Uniformity Laser: Advanced laser shaping technology ensures highly uniform and stable spot energy.
Wide Wafer Compatibility: Compatible with 4, 6, and 8-inch thin chip wafers for Micro LED production.
SEMI Standard Compliant: Equipped with EFEM transmission system supporting SECS-GEM communication.
Precise Control System: Strictly controls oxygen content and monitors optical energy stability.
Customization Available: Customized according to needs with OEM/ODM/Designing services.
RoHS ISO CE Certified: Meets international safety and quality standards including RoHS, ISO, and CE.
12 Months Warranty: Comprehensive one-year warranty with 24-hour online technical support.
High Mould Life: Designed for durability with a mould life exceeding 1,000,000 shots.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What wafers is the equipment compatible with?
A:
The equipment is compatible with 4, 6, and 8-inch thin chip wafers for Micro LED production.
Q:What certifications does the equipment have?
A:
The equipment holds RoHS, ISO, and CE certifications.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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