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Advanced Precision Curing Oven for Enhanced COB Production Efficiency
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Function

Abrasion Resistance

Model NO.

P-O-1

Demoulding

Pull Core

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Pneumatic

Mould Life

<300,000 Shots

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Nitrogen-Filled Oxygen-Free: Continuous nitrogen filling ensures a low-oxygen, clean working chamber for oxidation-free curing.
High Temperature Uniformity: Horizontal air recirculation and precise deflector control ensure uniform temperature distribution.
Nitrogen Saving System: Pressure reducing valve and double flow meter reduce nitrogen consumption in anaerobic environments.
Versatile Applications: Suitable for PI, BCB, LCP curing, photoresist curing, and electronic ceramic material drying.
Customizable Design: Customized according to needs, including specific product name and functional requirements.
Efficient Heating & Cooling: Adjustable heating rate and optional water/air cooling to shorten production cycles.
Durable Construction: Stainless steel interior and high-temperature-resistant motor ensure long-term stable operation.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the temperature control accuracy?
A:
The oven features a high-precision temperature controller with PID adjustment, achieving a control accuracy of 0.1 degrees Celsius.
Q:What is the oxygen content range?
A:
The oxygen content range varies by model: 1-5 percent, 500-2000PPM, or less than or equal to 100PPM.
Q:What is the temperature range of the oven?
A:
The temperature range is from Room temperature to 300 degrees Celsius.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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