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Advanced Precision Curing Oven for Enhanced COB Production Efficiency
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedFunction
Abrasion ResistanceModel NO.
P-O-1Demoulding
Pull CoreCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
PneumaticMould Life
<300,000 ShotsProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Nitrogen-Filled Oxygen-Free: Continuous nitrogen filling ensures a low-oxygen, clean working chamber for oxidation-free curing.
High Temperature Uniformity: Horizontal air recirculation and precise deflector control ensure uniform temperature distribution.
Nitrogen Saving System: Pressure reducing valve and double flow meter reduce nitrogen consumption in anaerobic environments.
Versatile Applications: Suitable for PI, BCB, LCP curing, photoresist curing, and electronic ceramic material drying.
Customizable Design: Customized according to needs, including specific product name and functional requirements.
Efficient Heating & Cooling: Adjustable heating rate and optional water/air cooling to shorten production cycles.
Durable Construction: Stainless steel interior and high-temperature-resistant motor ensure long-term stable operation.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the temperature control accuracy?
A:
The oven features a high-precision temperature controller with PID adjustment, achieving a control accuracy of 0.1 degrees Celsius.
Q:What is the oxygen content range?
A:
The oxygen content range varies by model: 1-5 percent, 500-2000PPM, or less than or equal to 100PPM.
Q:What is the temperature range of the oven?
A:
The temperature range is from Room temperature to 300 degrees Celsius.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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