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Advanced Precision Eutectic Welding Furnace for Chip Manufacturing
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Condition

New

Model NO.

VSR-8

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Vacuum Eutectic Welding Furnace

Application

Chip Packaging

Advantage

Factory Price

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Vacuum Reflow Soldering: Ultra-low void fraction technology suitable for high-end semiconductor chip packaging.
Formic Acid Deoxidation: Mature technology for formic acid oxidation suitable for low-temperature solder processes.
Flexible Customization: Customized heating plates, additional gas paths, and various oxidation removal modules available.
ISO Certified: Product meets international ISO certification standards for quality and safety.
12 Months Warranty: Comprehensive one-year warranty coverage for all mechanical equipment.
Advanced Control System: PLC touch screen or Windows control system for accurate temperature curve management.
OEM/ODM Service: Flexible customization options available for specific client requirements.
Integrated Design: Heating plate and workpiece fixture integrated for simple and convenient operation.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.81h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What are the customization options available?
A:
We offer flexible customization including customized heating plates, additional process gas paths, and various oxidation removal process modules.
Q:What control systems does the furnace support?
A:
The system can be equipped with a PLC touch screen control system or a Windows control system.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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