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Advanced Precision Laser Cutting for Silicon Carbide Wafers
US$750,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
HMLA-5560Processing Object
Silicon Carbide WafersLaser Type
Infrared Picosecond Pulsed LaserCooling Method
Air-CooledX-Axis
Stroke 450mm, Resolution 0.1μmY-Axis
Stroke 700mm, Resolution 0.1μmZ-Axis
Stroke 20mm, Resolution 0.1μmθ Axis
Travel 120°, Resolution 0.001°Transport Package
Wooden CaseSpecification
0*0*0Trademark
noneOrigin
ChinaKey features
High-Precision Laser Cutting: Infrared picosecond pulsed laser ensures high quality and efficient cutting of silicon carbide wafers.
Flexible Wafer Size Support: Standard 6-inch support with upgradeable capability to 8-inch silicon carbide wafers.
High-Speed Processing: Maximum cutting speed of 500mm/s ensures high-throughput processing for thick substrates.
Complete Solution Package: Provides a full set of splitting and expansion equipment for a complete operational solution.
Mature Cutting Process: Proven technology capable of cutting various types of silicon carbide wafers with high yield.
Low Maintenance Design: Air-cooled system offers compact design and requires minimal maintenance.
Customization Available: Flexible customization options including OEM and ODM services for tailored requirements.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the warranty period for this equipment?
A:
We provide a 1-year warranty and after-sales service for all our laser cutting systems.
Q:Can this system handle 8-inch wafers?
A:
Yes, the system supports standard 6-inch wafers and is upgradeable to handle 8-inch silicon carbide wafers.
Q:Do you offer OEM and ODM services?
A:
Yes, we offer flexible customization options including both OEM and ODM services.
Q:What are the lead times for production?
A:
Lead times vary by season: 1-3 months during off-peak season and 3-6 months during peak season.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set of the equipment.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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