Is OEM and ODM service available?

Yes, both OEM and ODM services are available with flexible customization options.

What certifications does the equipment have?

The equipment is ISO certified.

Advanced Precision Wafer Bonding System for High-Tech Applications

Name: Advanced Precision Wafer Bonding System for High-Tech Applications
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2122109975

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Model NO.

SHD8120S

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High Speed Efficiency: Delivers 4-8K UPH with high-speed chip mounting capabilities for mass production needs.

Flexible Customization: Features customized product names and features tailored according to specific customer needs.

Wide Compatibility: Supports wafer sizes from 8 to 12 inches and chip sizes from 0.5x0.5mm to 14x14mm.

Quality Assurance: Guaranteed quality with 100% finished product inspection including visual and function checks.

Low Void Rate: Ensures high reliability with solder voids limited to 2% (single) and 5% (total chip area).

Professional Support: Provides 24-hour online professional technical support and 12-month equipment warranty.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.

Q:What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

Q:What is the lead time for production?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.