Powered by Made-in-China.com
Advanced Wafer Bonding System with Live Monitoring Capabilities
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SE-2601Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Advanced Die Attachment System for Precision Wafer Bonding
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced High-Speed Automatic Die Attach System for Precision Bonding
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced Hanwha SMT Placement System for Efficient PCB Assembly
US$75,000.00-85,000.00
1 Piece(MOQ)
Jutze Mi-3000 in-Line 2D Aoi System with Adjustable Resolution for SMT
US$30,000.00-50,000.00
1 Piece(MOQ)
Advanced Industrial Pulse Laser Cleaning System for Surface Restoration
US$10,000.00-100,000.00
1 Piece(MOQ)
Advanced FUJI SMT Placement System for Versatile PCB Assembly
US$75,000.00-85,000.00
1 Piece(MOQ)
FUJI Advanced Intelligent Servo SMT Pick and Place System for PCB Assembly
US$75,000.00-85,000.00
1 Piece(MOQ)
Lab Using Small Die Bonder, Die Bonding System with High Precision
US$90,500.00-119,000.00
1 Piece(MOQ)
Small Die Bonding System for High Precision Mounting
US$90,500.00-119,000.00
1 Piece(MOQ)
Pemtron New 3D New Aoi Inline SMT Online 3D Solder Paste Inspection System
US$105,000.00
1 Piece(MOQ)
Nordson High Magnification Inspection Ruby XL X-ray Inspection System
US$9,999.00-39,999.00
1 Piece(MOQ)
Electronic High Precision SMT Pick and Place Machine High Speed LED PCB Making Machine Ten-Head-Five-Vision Component Alignment System
US$30,000.00-65,000.00
1 Piece(MOQ)
Innovation Technologies Vacuum Ion Implantation System
US$1,000,000.00-2,000,000.00
1 Piece(MOQ)
dB100 Series High Precisiondie Bonding System
US$30,999.00
1 Set(MOQ)
PCBA Equipment Tri Tr7500 Siii SMT 3D Aoi Automated Optical Inspection System
US$8,888.00-38,888.00
1 Piece(MOQ)
Saki 3D Aoi 3di-Ls3ex PCB Automated Optical Inspection System
US$8,888.00-35,888.00
1 Piece(MOQ)
Juki Versatile LED SMT Placement System for High-Volume Production
US$82,500.00
1 Piece(MOQ)