What is the minimum order quantity?

The minimum order quantity is 1 Set.

Advanced Self-Cleaning Vertical Furnace with Durable Pi Cuer Alloy

Name: Advanced Self-Cleaning Vertical Furnace with Durable Pi Cuer Alloy
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2119465115

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Fully Automatic Vertical Furnace

Application

Integrated Circuit Wafer Glue, Bpo Glue

Feature 1

Fec Heating

Feature 2

Rapid Temperature Rise

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Self-Cleaning Function: Features high-temperature self-cleaning capability for maintenance-free operation.

Rapid Temperature Rise: FEC heating technology ensures rapid temperature rise with excellent uniformity.

High Efficiency Automation: Integrated HMI and automated production save labor, electricity, and process time.

Durable Construction: Made of high-quality stainless steel with physical and chemical polishing for cleanliness.

Wide Application Scope: Suitable for IC wafer glue curing, BPO, PI, BCB glue, and rapid annealing.

Advanced Control System: Touch screen HMI with embedded controller, servo/stepper motion, and data recording.

Flexible Customization: OEM and ODM services available with flexible customization options for specific needs.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.81h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What materials can be processed by this furnace?

It is used for integrated circuit wafer glue, BPO glue, PI glue, BCB glue curing, and rapid annealing of IC wafers.

Q:What is the throughput capacity of the furnace?

The throughput is 75PCS per tube, with a total capacity of 150PCS.

Q:Does the machine support atmosphere control?

Yes, it uses multi-channel flowmeters to regulate air intake with a range of 0-150L/min for nitrogen and 0-40L/min for oxygen.