Advanced Semiconductor Oven for Precision Inert Gas Processing

Name: Advanced Semiconductor Oven for Precision Inert Gas Processing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2119463415

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Vacuum High Temperature Oxygen Free Oven

Application

Scientific Research and Production Units

Feature 1

Fast Heating

Feature 2

Energy Saving

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Energy Saving Nitrogen System: Unique air supply system saves nitrogen at 30LPM while ensuring furnace box cleanliness.

Versatile Semiconductor Application: Suitable for BPO/PI glue curing, IC wafer, CMOS, MEMS, and FFP drying processes.

12-Month Comprehensive Warranty: Includes one-year warranty with 24-hour online professional technical support.

Flexible OEM/ODM Customization: Supports flexible customization for product names, applications, and specific features.

High Cleanliness Standard: Class 100 cleanliness with metal filters ensuring dust-free drying for electronic components.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.72h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Is customization available?

Yes, flexible customization is available for product names, applications, and features.

Q:What is the lead time for orders?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.

Q:What payment terms are accepted?

We accept LC, T/T, PayPal, and Western Union for payment.