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Advanced Semiconductor Wafer Annealing Furnace for Enhanced Efficiency
US$108,000.00-2,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceFunction
High Temperature ResistanceModel NO.
VAF001Demoulding
AutomaticCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsFull External Sealing Metal Shell
Double-Layer Furnace ShellCooling Method
Water-CoolingDual Heating Elements
Electric Heating WireElectric Heating Wire
Base Vacuum: 50 PATemperature Range
1000°C, 1200°C, 1600°CIntelligent Temperature Controller
Multi-Stage ProgrammabilityTemperature Accuracy
±1°C with Pid TuningSealing Mechanisms
Furnace Mouth Silica Gel SealingSafety Protections
Auto Power Cutoff for Over-TemperatureCooling System
Sandwich Water-CoolingTransport Package
Air FreightSpecification
1200Trademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
Vacuum Environment Capability: Pre-vacuumized to 50 Pa with top waste gas discharge for heat treatment.
Double-Layer Furnace Design: Full external sealing metal shell with sandwich water-cooling for low surface temperature.
Intelligent Temperature Control: Multi-stage programmability allows editing, storing, and calling complex heating programs.
Comprehensive Safety Protections: Auto power cutoff for over-temperature and electrical leakage detection.
ISO Certified Quality: Manufactured and inspected according to ISO standards with 100% finished product inspection.
Flexible Customization Options: OEM and ODM services available with flexible customization for specific requirements.
12 Months Warranty Coverage: Includes 24-hour online professional technical support for one year.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.95h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the vacuum level of the furnace?
A:
The equipment can be pre-vacuumized to 50 Pa.
Q:Does the furnace have safety protection features?
A:
Yes, it includes auto power cutoff for over-temperature and automatic power cut-off when the furnace body leaks electricity.
Q:What heating elements are used?
A:
Heating elements include electric heating wire and silicon molybdenum rod (MoSi2) depending on the temperature requirements.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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