What is the average lead time for production and shipping?

Lead times vary by season: 3-6 months during peak season and 1-3 months during off-season.

What quality inspection processes are performed before shipping?

Every finished product undergoes 100% inspection, including both visual and functional checks, before packing.

Advanced Wafer Bonding Equipment for High-Performance Melt Solutions

Name: Advanced Wafer Bonding Equipment for High-Performance Melt Solutions
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2111012035

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Warranty

12 Months

Model NO.

JYJ-200A/JYJ-200B/JYJ-200C

Product Name

Wafer Bonding Equipment

Application

for Hot Pressing Bonding

Certification

ISO

Condition

New

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Multi-Model Versatility: Offers JYJ-200A, 200B, and 200C models for diverse bonding needs.

Wide Material Compatibility: Supports SiC, metals, ceramics, polymers, and MEMS wafer bonding.

High Precision Performance: Features high bonding pressure and excellent temperature uniformity.

Flexible Customization: Provides OEM/ODM services with flexible customization options.

Global Supply Chain: Exported to over 30 countries with a robust supplier network.

Quality Assurance: 100% inspection including visual and function checks before shipping.

Professional Support: 24-hour online technical support and one-year warranty included.

Cost-Effective Solutions: Aims to provide the highest cost-effective products for customers.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:What are the main applications of this wafer bonding equipment?

It is used for SiC seed crystal preparation, hot pressing bonding of dissimilar materials, wafer level packaging for MEMS, and bonding of aluminum alloys, stainless steel, and ceramics.

Q:What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support.

Q:How can I choose the most suitable machine model?

Please provide the working piece material, size, and specific functional requirements. Our team will recommend the best model based on our experience.

Q:Does the equipment support customization or OEM/ODM services?

Yes, we offer flexible customization options, including OEM and ODM services, to meet specific customer needs.

Q:What are the payment terms and minimum order quantity?

The minimum order quantity is 1 set. Payment terms include LC, T/T, PayPal, and Western Union.