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Precision Automation Lead Wedge Welding Equipment for Professionals
US$100,000.00-200,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

12 Months

Model NO.

HM001

Product Name

Welding and Bonding Machine

Feature 1

High Precision

Feature 2

High Efficiency

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

High Efficiency Operation: Bonding speed reaches 1.2 seconds per line for maximum productivity.
Full Process Visualization: Enables online monitoring of welding quality and save process data.
Flexible Customization: Offers OEM/ODM/Designing service with flexible customization options.
Wide Application Range: Suitable for semiconductor devices, hybrid circuits, and microwave components.
Precise Pressure Control: Bonding pressure adjustable from 5GF to 150GF for various materials.
Machine Vision Programming: Features machine vision teaching and programming capabilities.
Comprehensive Warranty: Includes 12-month warranty with 24-hour online technical support.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the bonding speed?
A:
The bonding speed is 1.2 seconds per line, depending on the product situation.
Q:What is the maximum welding range?
A:
The welding range is 150 x 150 mm.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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