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Advanced Wafer Inspection System for Clear Imaging and High Contrast
US$500,000.00-600,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
on-Site AvailableWarranty
1 YearModel NO.
3200/3100/3000Type
3D Video Measuring SystemOperate Method
CNCTransport Package
Wooden BoxOrigin
JapanHS Code
9031499000Production Capacity
1000Key features
Clear High-Contrast Imaging: Produces clear images with high contrast and minimal flare for accurate macro inspections.
Advanced Image Processing: State-of-the-art technology enables highly accurate review inspections for 300mm wafers.
Flexible Load Port Positioning: Meets various factory automation layouts and supports OHT and automatic transfer systems.
Touch-Screen Recipe Creation: Easily accessible touch-screen allows simple creation of optimal observation settings.
High System Stability: Inherits proven high system stability and high-transfer rate from front-end processes.
Comprehensive Inspection Coverage: Standard macro surface, edge, and center back side inspection with manual joystick control.
Superior Operability: Extra-long working distance lens prevents image skipping during objective switching.
Dual Wafer Size Support: 200mm cassette adapter enables combined transfer of 200mm and 300mm wafers on a single unit.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.85h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What wafer sizes does the system support?
A:
The system supports 300mm wafers as standard and 200mm wafers via an optional cassette adapter for combined transfer.
Q:What is the warranty period?
A:
The system comes with a 1-year warranty and on-site after-sales service is available.
Q:Does the system support factory automation?
A:
Yes, flexible load port positioning allows the equipment to meet various layouts and supports OHT and other automatic transfer systems.
Q:Can the inspection settings be customized?
A:
Yes, optimal recipe conditions including aperture and light intensity can be set in advance via an easily accessible touch-screen.
Q:What are the available models?
A:
Available models include 3200 (2 load ports), 3100 (1 load port), and 3000 (1 load port), with options for 200mm or 300mm wafers.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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