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Efficient Automated Wafer Handling System for Enhanced Output
US$50,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Warranty

One Year Service

Model NO.

HM-01

Application

Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Metal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Wafer Compatibility

Suitable for Wafer Transfer of 300mm and Below

Trajectory Function

Can Realize Free End Trajectory and Oblique Insert

Manipulator Cup Type

Single Arm (Anti-Fog)

Manipulator Arm Model

Rb100swp

Control Axis

3

Power Supply

AC 220V 2.2A Vacuum

Weight

40kg

Wafer Support

300mm and Smaller Wafers (200mm, 150mm)

Transport Package

Packed with Wooden Box by Sea Shipping

Specification

1500kg

Trademark

Himalaya

Origin

China

Production Capacity

5000

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.67h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Send Inquiry

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