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Advanced GaN Wafer Laser Dicing System for Semiconductor Precision
US$200,000.00-300,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
SupportWarranty
1 YearModel NO.
DC-01Application
SemiconductorCooling System
Air CoolingTechnical Class
Pulse LaserApplicable Material
NonmetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingLaser System
Optimized for Sic/GaN/Ln/LtWavelength Options
IR (1064nm/532nm) + UV (355nm)Cutting
Hipping: <5μm (Sic), <3μm (Ln/Lt)High-Precision Vision System
Auto-Alignment (±0.5μm)Wafer Compatibility
Quick-Change Chucks (150mm/200mm)Edge Exclusion
≤1mmCutting Speed
400-1000mm/S (Programmable)Travel Range
300mm × 300mmTransport Package
Wooden PackSpecification
CustomizedTrademark
HimalayaOrigin
ChinaProduction Capacity
1000Key features
Zero Mechanical Stress: Subsurface modification technology eliminates mechanical stress during dicing.
Wide Wafer Compatibility: Supports 150mm and 200mm wafers with quick-change chucks in under 3 minutes.
Smart Fab Integration: Cassette-to-cassette operation compliant with SEMI S2/S8 standards.
Customized Laser System: Optimized for SiC, GaN, LN, and LT with specific wavelength options (IR/UV).
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What Incoterms are best for semiconductor tools?
A:
FOB, CIF, CFR etc
Q:How long is the lead time?
A:
around 2-3 months
Q:Do you provide customer service?
A:
Yes, we do provide customer servce and we provide on-line technical consultation and on-site installation service.
Q:What is the warranty period for this system?
A:
We provide a 1-year warranty for the Advanced GaN Wafer Laser Dicing System.
Q:What is the cutting speed of the laser dicer?
A:
The cutting speed is programmable between 400-1000mm/s.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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