What are the payment terms?

Payment terms include LC, T/T, PayPal, and Western Union.

What is the lead time for production?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.

Equipment Factory Rapid Wire Bonding Machine for Production Line

Name: Equipment Factory Rapid Wire Bonding Machine for Production Line
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1965515171

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Model NO.

WBM-0131

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Wire Bonding Machine

Item Number

Rapid-1

Wire Diameter

0.6 Mil to 2.5 Mil Copper, Silver O

Pattern Recognition

Advanced Vision Scanning Engine

CCD Camera

2X Vision Magnification (2X & 6X)

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

High Speed Performance: Super high speed chip mounter with changeover time under 4 minutes for same leadframe.

Versatile Wire Capability: Supports 0.6 to 2.5 mil Copper, Silver, or Gold wires with ultra-low wire height of 40 um.

Advanced Vision System: Features 2x and 6x vision magnification with programmable high-power magnifier focus.

Flexible Material Handling: Handles lead frames from 90 to 300 mm length and 15 to 100 mm width with various thicknesses.

Smart Networking: Equipped with K&S Connect for data traceability and optional KNet PLUS for real-time monitoring.

Customization Support: Offers OEM/ODM services and flexible customization options for specific production needs.

User Friendly Interface: Features a 21.5-inch color LCD display with user-friendly menus and dedicated function keys.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.85h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What types of wires can be bonded?

It supports 0.6 mil to 2.5 mil Copper, Silver, or Gold wires.

Q:What is the minimum order quantity?

The minimum order quantity is 1 Set.