Powered by Made-in-China.com
Advanced Precision Wire Bonding Machines for Semiconductor Production
US$7,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
HM-WB-01Speed
High SpeedPrecision
PrecisionCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterOnline Technical Guidance
Per RequiredVisit The Production and Use of Customer
2-4 Times/YearInstallations
VerticalModel Number
H580plusLinear Table Size
56mm × 80mmLinear Table
Linear Motor-Driven Xy TablePrecision & Speed
45ms/Line Bonding CycleFreight
Air, Sea or RailwayTransport Package
Wooden PackSpecification
985mm * 960mm * 1770mmTrademark
HimalayaOrigin
ChinaProduction Capacity
100Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.00h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
You may also like
Advanced High-Precision Automatic Die Bonding Machine for Semiconductors
US$7,000.00-70,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
High-Speed Wire Bonding Machine for Production Line
US$7,000.00-70,000.00
1 Piece(MOQ)
Used Asm Wire Bonder, High Precision Automatic Die & Wire Bonding Machine for Semiconductor Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Juki RS-1r Advanced SMT Placement Machine for High Precision Electronics Production
US$32,000.00-40,000.00
1 Piece(MOQ)
Advanced Die Bonding Machine for Superior Solidification Quality
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced Packaging Manual Semi-Auto Ultrasonic Gold Ball Wedge Wire Bonder Bonding Machine
US$51,000.00-80,000.00
1 Piece(MOQ)
Heavy Wire Bonder Wire Bonding Machine for to Package
US$140,000.00-220,000.00
1 Piece(MOQ)
Advanced Full Automatic Panasonic PCB Mounting Machine for SMT Production
US$55,000.00-85,000.00
1 Piece(MOQ)
Kohyong 3D Inline Aoi Solution for Efficient SMT Production Acf Bonding Machine
US$105,600.00
1 Piece(MOQ)
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
US$120,000.00-149,000.00
1 Piece(MOQ)
Juki RS-2 Advanced SMT Machine for Precision Electronics Assembly LED SMD
US$80,000.00
1 Piece(MOQ)
Advanced T8 Machine for Precision Manufacturing and Assembly
US$13,000.00
1 Piece(MOQ)
Hanwha SMT Pick-and-Place Machine for Precision Electronics Manufacturing in PCB Production Line
US$55,000.00-85,000.00
1 Piece(MOQ)












