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High-Performance Automated Die Bonding Equipment for Precision Assembly
US$7,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewModel NO.
Clip bonderSpeed
Super High SpeedPrecision
High PrecisionCertification
ISO, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Clip Bonder MachineTwo Options
Vacuum and Flat FurnaceClip Placement Accuracy
+/-5 Um @ 3 SigmaBond Force Range
10 N to 250 NCompatible Attachment Materials
Solder Paste, Epoxy, or Silver Sintering PasteVision Systems
up and Down Looking CameraTransport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High Precision Bonding: Features a high-precision linear welding head with +/-5 Um placement accuracy.
Super High Speed: Ultra-high-speed chip mounter designed for maximum throughput and efficiency.
Flexible Sintering Options: Offers two sintering furnace choices: vacuum and flat furnace.
Comprehensive Vision System: Equipped with up and down looking cameras for precise alignment.
Wide Bond Force Range: Supports bond force from 10 N to 250 N for reliable connections.
Multi-Material Compatibility: Compatible with solder paste, epoxy, or silver sintering paste.
Certified Quality: Meets ISO and CE certification standards for safety and quality.
Free Training Support: Includes free training services for operators and maintenance staff.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the placement accuracy of the clip bonder?
A:
The placement accuracy is +/-5 Um @ 3 Sigma, ensuring high precision for electrical connections.
Q:What materials are compatible with this bonding machine?
A:
It is compatible with solder paste, epoxy, or silver sintering paste.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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