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High-Performance Thermal Bonding Equipment for to-220 and to-263
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewModel NO.
TO220 BDSpeed
Super High SpeedPrecision
High PrecisionCertification
RoHS, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Die Bonding MachineItem Number
SD-8012Suitable with
to-220/247/252/263Bonding Pressure
30-300g (Programmable)Track Width
up to 70mmWafer Size
12/ 8/6 InchesTin Wire Diameter
0.25-1mmTin Delivery Mode
Sn, Write, Press (Optional)Transport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High Speed & High Precision Mounting
Strict Solder Layer Control
Wide Compatibility, Fully adapts TO-220, TO-247, TO-252, TO-263
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.66h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the core advantage of soft solder bonding compared with traditional die bonding?
A:
Better thermal conductivity, lower thermal resistance, stable high-temperature resistance, effectively improve heat dissipation efficiency of power devices, suitable for high-power component packaging with strict heat dissipation requirements.
Q:Can this equipment process irregular-shaped power chips?
A:
Yes, it supports chip sizes within 0.5*0.5mm to 14*15mm, compatible with most regular and conventional irregular power chips in the industry.
Q:Is the solder void rate controllable in mass production?
A:
The equipment adopts precise temperature control and constant-pressure bonding design, stably controls single void within 1% and total void within 3%, fully meets industrial high-standard packaging requirements.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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