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High-Precision Laser Imaging Technology for Efficient Line Processing
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingFunction
Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-ColdModel NO.
LDI - E15 LDI - I30 LDI - Q30 LDI - QM30Demoulding
Pull CoreCondition
NewCertification
RoHS, CEWarranty
12 MonthsAutomatic Grade
SemiautomaticInstallation
DesktopDriven Type
PneumaticMould Life
>1,000,000 ShotsProduct Name
Laser Direct Imaging SystemAdvantage 1
High ResolutionAdvantage 2
High Efficiency ProcessingAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High Resolution Processing: Minimum analytical capacity up to 15/15um for fine line processing.
High Efficiency Digital Operation: Independent super algorithm DMD control system for industry 4.0 integration.
Wide Panel Thickness Range: Supports 0.05 mm to 5.0 mm for single machine applications.
Robust Durability: Features abrasion, lubrication, high temperature, anti-corrosion, and anti-cold resistance.
Long Mould Life: Designed for over 1,000,000 shots for extended operational lifespan.
Flexible Customization: OEM/ODM services and flexible customization options available.
Certified Quality: Complies with RoHS and CE certification standards.
Professional Support: Includes free training and 24-hour online technical support.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the minimum analytical capacity?
A:
The minimum analytical capacity is up to 15/15um, meeting msAP process requirements.
Q:What are the maximum exposure sizes?
A:
Large Table: 24.5' x 28.5' (622.3 mm x 723.9 mm); Standard Table: 22' x 24.5' (558.8 mm x 622.3 mm).
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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