SourcingAI
Try for free
Powered by Made-in-China.com
Semiconductor Wafer Laser Scribing Dicing Die Modification Separator / Wafer Stealth Laser Dicing Saw
US$350,000.00-420,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Function

Wafer Laser Dicing

Model NO.

MD

Demoulding

Automatic

Condition

New

Certification

CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Transport Package

Wooden Case

Trademark

minder-hightech

Origin

China

Production Capacity

1000

Key features

Stealth Laser Dicing Technology: Avoids mechanical damage by focusing laser inside material to form cracks for clean separation.
Multi-Material Compatibility: Suitable for sapphire, silicon, germanium, silicon carbide, zinc oxide, and GaN wafers.
High Precision Positioning: Achieves 1um positioning accuracy with repeat positioning accuracy of 1um.
Automatic Visual Alignment: Features multi-camera visual capture for edge detection, automatic alignment, and focusing.
Flexible Wafer Sizes: Supports processing of 4-inch, 6-inch, 8-inch, and 12-inch wafers.
High Processing Efficiency: Maximum processing speed reaches 1000 wafers per second.
12-Month Warranty Coverage: Includes 12-month warranty with cost-price replacement for parts after expiration.
Optional Focus Configurations: Available in single, dual, or multi-focus options to suit specific needs.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.92h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:Are your prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you provide sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid when equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, an acceptance video is sent. You may also visit the site to inspect the equipment.
Q:Do you provide installation and debugging services?
A:
Yes, we dispatch engineers to your factory for installation and debugging. A separate quotation applies for this service.

Send Inquiry

*To:Guangzhou Minder-Hightech co.,LtdGuangzhou Minder-Hightech co.,Ltd
*Content:
0/4000

Supplier replies will be sent to your registered email

You may also like