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Semiconductor Wafer Laser Scribing Dicing Die Modification Separator / Wafer Stealth Laser Dicing Saw
US$350,000.00-420,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvideFunction
Wafer Laser DicingModel NO.
MDDemoulding
AutomaticCondition
NewCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Key features
Stealth Laser Dicing Technology: Avoids mechanical damage by focusing laser inside material to form cracks for clean separation.
Multi-Material Compatibility: Suitable for sapphire, silicon, germanium, silicon carbide, zinc oxide, and GaN wafers.
High Precision Positioning: Achieves 1um positioning accuracy with repeat positioning accuracy of 1um.
Automatic Visual Alignment: Features multi-camera visual capture for edge detection, automatic alignment, and focusing.
Flexible Wafer Sizes: Supports processing of 4-inch, 6-inch, 8-inch, and 12-inch wafers.
High Processing Efficiency: Maximum processing speed reaches 1000 wafers per second.
12-Month Warranty Coverage: Includes 12-month warranty with cost-price replacement for parts after expiration.
Optional Focus Configurations: Available in single, dual, or multi-focus options to suit specific needs.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.92h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:Are your prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you provide sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid when equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, an acceptance video is sent. You may also visit the site to inspect the equipment.
Q:Do you provide installation and debugging services?
A:
Yes, we dispatch engineers to your factory for installation and debugging. A separate quotation applies for this service.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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