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High-Precision UV Picosecond Laser Cutter for OLED Displays
US$50,000.00-150,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Warranty

12 Months

Model NO.

PMLC-01

Application

Home Appliance, Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Nonmetal

Structure Type

Gantry Type

Laser Classification

Free Electron Laser

Laser Technology

Laser Control Fault Cutting

Laser Type

Ultrafast Picosecond Laser

Pulse Duration

<15 PS (Picoseconds)

Wavelength

355nm/532nm/1064nm (UV/Green/IR)

Average Power

10-100W (Configurable)

Repetition Rate

100kHz-10MHz

Beam Quality (M²)

<1.3

Cutting Accuracy

±5 Micron

Minimum Spot Size

10-25 Micron

Heat Affected Zone (Haz)

<10 Micron

Transport Package

Crate

Specification

1500×1200×1800mm

Trademark

Himalaya

Origin

China

Production Capacity

1000

Key features

Micron-Level Precision: Achieves cutting accuracy of +/-5 um with positioning accuracy of +/-2 um for flawless edges.
Minimal Heat Affected Zone: HAZ under 10 um prevents thermal damage, burning, and deformation of sensitive flexible layers.
Ultrafast Picosecond Laser: Pulse duration under 15 ps enables high-speed cutting up to 1000mm/s with superior quality.
Wide Wavelength Options: Available in 355nm UV, 532nm Green, and 1064nm IR to suit various flexible materials.
Customizable Dimensions: Machine size can be tailored to specific needs, typically 1500x1200x1800mm.
Configurable Power Output: Average power ranges from 10W to 100W to optimize performance for different applications.
Non-Contact Processing: Eliminates mechanical stress, tool wear, and contamination, ensuring consistent quality.
ISO 9001 Certified Quality: Manufactured by an ISO 9001 certified company with 100% finished product inspection.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.02h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:What materials can this laser cutter process?
A:
It is suitable for flexible OLEDs, LCDs, Polyimide (PI), PET Films, and Thin Glass Substrates.
Q:What is the cutting accuracy of the machine?
A:
The machine achieves a cutting accuracy of +/-5 microns and a positioning accuracy of +/-2 microns.
Q:Is the machine size customizable?
A:
Yes, dimensions are customizable, typically around 1500x1200x1800mm, to fit specific production lines.
Q:What is the lead time for orders?
A:
Lead time is 1-3 months during off-peak season and 3-6 months during peak season.
Q:Does the machine support OEM and ODM services?
A:
Yes, both OEM and ODM services are available with flexible customization options.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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