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Innovative Drilling Solutions for Challenging and Brittle Materials
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedFunction
Abrasion ResistanceModel NO.
DR01Demoulding
Pull CoreCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
ManualInstallation
VerticalDriven Type
PneumaticMould Life
<300,000 ShotsProduct Name
Thin Film Laser DrillingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Drilling Efficiency: Achieves 20-100 holes per second on PE film and 3-5 seconds per hole on ferrite.
Versatile Material Processing: Suitable for hard-brittle materials including sapphire, silicon wafers, and ceramics.
Customizable Hole Shapes: Supports straight, tapered, and shaped hole drilling techniques.
Flexible Customization: Offers flexible customization options to meet specific needs.
ISO Certified Quality: Product meets ISO certification standards for reliability.
Free Process Software: Self-developed software allows free setting of process menus.
12 Months Warranty: Comes with a 12-month warranty period for peace of mind.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this laser drill?
A:
It processes various thin films and hard-brittle materials like ferrite, sapphire, glass, silicon wafers, ceramics, and heat-sensitive polymers.
Q:Is the machine fully automatic?
A:
The machine features a gantry structure with options for both manual and fully automatic loading and unloading.
Q:What are the power requirements?
A:
The power requirement is 220V/50Hz/16A with overall power consumption under 2000W.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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