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Precision Glass Cutter for Creating Beautiful 3D Art Designs
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Warranty

Provided

Automatic Grade

Manual

Installation

Vertical

Driven Type

Pneumatic

Product Name

Glass Cutting & Lobing

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Picosecond Laser Technology: Ultra-fast pulsed picosecond laser with high peak power for stable and reliable performance.
Patented Cutting Process: Self-developed patent technology ensuring excellent kerf quality with no surface damage.
High Dimensional Accuracy: Small chipping and low thermal impact for excellent processing quality on glass and sapphire.
Automated Functionality: Integrated automatic loading, unloading, inspection, sorting, and lobe functions.
Versatile Material Support: Cuts full-screen glass, sapphire, digital 3D covers, optical glass, and filter glass.
Long Laser Lifespan: Laser life exceeds 20,000 hours for sustained industrial use.
Flexible Customization: Customized according to needs with ODM and OEM services available.
Integrated Control System: Software integrates vision, laser, and motion control for precision.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.76h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this machine cut?
A:
It supports cutting of full-screen glass, sapphire, digital 3D front and back cover glass, various optical glass, and filter glass.
Q:What are the laser specifications?
A:
The cutting laser is a 1064nm Picosecond laser with 70W power, and the lobe laser is a CO2 laser with 55W power. Laser life is over 20,000 hours.
Q:Does the machine support automation?
A:
Yes, it features automatic loading and unloading, inspection, sorting, and lobe functions.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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