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Precision Laser Cutting Systems for Semiconductor Production Efficiency
US$200,000.00-300,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Support

Warranty

1 Year

Model NO.

HM-LA-01

Application

Semiconductor

Cooling System

Air Cooling

Technical Class

Pulse Laser

Applicable Material

Nonmetal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Laser System

Optimized for Sic/GaN/Ln/Lt

Wavelength Options

IR (1064nm/532nm) + UV (355nm)

Cutting

Hipping: <5μm (Sic), <3μm (Ln/Lt)

High-Precision Vision System

Auto-Alignment (±0.5μm)

Wafer Compatibility

Quick-Change Chucks (150mm/200mm)

Edge Exclusion

≤1mm

Cutting Speed

400-1000mm/S (Programmable)

Travel Range

300mm × 300mm

Transport Package

Wooden Pack

Specification

Customized

Trademark

Himalaya

Origin

China

Production Capacity

1000

Key features

Material-Specific Optics: Tailored for SiC, GaN, LN/LT with burst-mode and Q-switched operation.
Full Automation Integration: Cassette-to-cassette operation compliant with SEMI S2/S8 standards.
Flexible Wafer Compatibility: Quick-change chucks for 150mm/200mm wafers in under 3 minutes.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.42h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:What Incoterms are best for semiconductor tools?
A:
FOB, CIF, CFR etc
Q:How long is the lead time?
A:
around 2-3 months
Q:Do you provide customer service?
A:
Yes, we do provide customer servce and we provide on-line technical consultation and on-site installation service.

Send Inquiry

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