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Professional 20W Green Laser Engraving Machine for Precision Work
US$7,000.00-50,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsLaser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
UV Laser, CO2 LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
PCBA & IC & Wafer Marking MachineFeature 1
High PrecisionFeature 2
High EfficiencyAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Efficiency Output: Marking speed reaches 1200 pieces/hour (idle) for rapid production cycles.
Intelligent Vision System: Features direction inspection and sampling inspection functions for quality control.
Dual Laser Source Options: Supports green, UV, and CO2 laser sources to suit different material needs.
Automatic Loading System: Fully-automatic loading and unloading from hanging basket to hanging basket.
CE and SEMI Certified: Complies with CE MARK and SEMI standards for safety and quality assurance.
Effective Fume Removal: Special fume removal device quickly extracts fume and dust to protect the environment.
12-Month Warranty: Provides a one-year warranty with 24-hour online professional technical support.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What materials can this machine mark?
A:
It is applicable for metal materials, specifically packaged IC marking of DIP, QFN, and BGA.
Q:What are the marking scopes available?
A:
The marking scope is 320mm*160mm for both HDZ-SIC100 and HDZ-SIC200 models.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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