What is the minimum order quantity?

The Minimum Order Quantity is 1 Set.

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Terms of Payment include LC, T/T, PayPal, and Western Union.

Ultra-Precision UV Laser Cutter for Wafer Production Efficiency

Name: Ultra-Precision UV Laser Cutter for Wafer Production Efficiency
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2082060322

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$5,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Warranty

24 Months

Model NO.

LCM-002

Application

Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Nonmetal

Structure Type

Desktop

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Condition

New

Product Name

Automatic Laser Cutting

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Stable UV Laser Source: Features a 355nm UV laser with stable performance and good light spot quality.

Vacuum Absorption System: Prevents wafer movement during platform motion, ensuring cutting accuracy.

Automated Handling: Supports automatic loading/unloading, robot carrying, and automatic edge searching.

Wide Wafer Compatibility: Applicable for 2, 4, 8, and 12-inch wafer cutting processing.

Flexible Customization: Offers OEM/ODM services and customized solutions according to specific needs.

Professional Technical Support: Provides 24 hours online professional technical support and free training.

High Efficiency Software: Equipped with a high-efficient, flexible software system with a simple interface.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.16h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What is the laser wavelength and power?

The laser wavelength is 355nm. The laser power is 15W.

Q:What types of wafers can this machine process?

It is applicable for 2 inch, 4 inch, 8 inch, and 12 inch wafers cutting processing.