High-Precision Asm Ad830plus Die Bonder Semiconductor Asmpt Die Bonding Machine

Name: High-Precision Asm Ad830plus Die Bonder Semiconductor Asmpt Die Bonding Machine
Brand: Guangdong Xinling Intelligent Equipment Co., Ltd
SKU: 2303942875

Guangdong, ChinaGuangdong Xinling Intelligent Equipment Co., Ltd

US$19,999.00-23,999.00

1 Piece

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

High Temperature Resistance

Model NO.

AD830Plus

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Delivery

1-7 Days

MOQ

1PC

Quality

100% Tested

Adaptation

Die Bonder

Inventory

Availability

Transport Package

Wooden Case

Specification

180*180*180

Trademark

asm

Origin

Germany

HS Code

8479909090

Production Capacity

Key features

Ultra-high-speed die bonding with a cycle time of just 0.16s, achieving up to 22,000 UPH

FPrecision alignment system delivering 25.4 accuracy for precise die placement.

Quick changeover and versatility, supporting a wide range of die sizes and substrate types

Company profile

Importers and ExportersSelf-brandedYears of Export ExperienceHigh Repeat Buyers Choice

Guangdong Xinling Intelligent Equipment Co., Ltd

Guangdong, China

Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤6.27h

About Our Factory & Business Background

AddressShenzhen, Guangdong, China

Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Minimum Order Quantity1 pc

Supply Chain Partners10

Our Production Capability & Technical Expertise

Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester

QA/QC inspectors1 people

Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

R&D Engineers5 people

Traceability of Raw MaterialsYes

Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsEurope

Number of Foreign Trading Staff3

Overseas Agent/BranchNo

New Products Launched in Last yearYes

Product Q&A

Q:What products can you provide?

semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.

Q:Can I get a sample and what is your MOQ?

Yes, the sample is available, and our MOQ is 1 piece.

Q:How long will it take to deliver the goods?

About 1 to 7 working days.

Q:What kinds of brands of parts can you provide?

We have asmpt,besi, etc.

Q:What is the warranty of machine ?

We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.