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Gsma Compliant Esim IC Remote SIM Provisioning Component
US$0.89
100 Pieces
Product profile
Customization
AvailableConductive Type
Unipolar Integrated CircuitIntegration
LSIModel NO.
eSIM chipOperating Temperature
-20℃+70℃Shape
FlatTechnics
Semiconductor ICTransport Package
Standard PackagingSpecification
StandardTrademark
OriginalOrigin
ChinaHS Code
8523529000Key features
GSMA Compliant eSIM IC: Remote SIM provisioning component meeting GSMA standards.
Unipolar Integrated Circuit: Conductive type designed for efficient semiconductor performance.
LSI Integration: Large Scale Integration technology for complex circuit processing.
Flat Shape Design: Compact flat geometry suitable for modern electronic packaging.
Semiconductor IC Technics: Advanced semiconductor manufacturing techniques ensure quality.
Standard Packaging: Protected with standard packaging for safe shipping and storage.
Made in China: Originates from Nantong, Jiangsu, China with original trademark.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyAverage Response Time: ≤24h
AI-Powered supplier vetting
SummaryJiangsu Hongxin Semiconductor Technology Co. is a trade company based in Nantong, China, operating in the manufacturing industry. The company exports diesel engine parts to various global regions and maintains a quality-centric approach. Despite having extensive export experience and a complete industrial chain, the company lacks significant innovation and customization capabilities, with no recent new products or ODM/OEM services for known brands. Financial information is limited, and the company does not demonstrate any strong overseas infrastructure or participation in offline trade shows.
After-Sales capabilityThe supplier emphasizes a customer-centric approach, offering professional after-sales service tailored to diverse needs.
R&D capabilityThe supplier lacks innovation capacity, with no new products or ODM services available in the past year.
Production capacityThe supplier has a high production output of diesel engine parts, indicating strong production capability.
Customization capabilityThe supplier offers customized product solutions for various customer needs.
Product Q&A
Q:What package type is used for this eSIM?
A:
This eSIM chip uses the MFF2 package design.
Q:What is the integration level of the chip?
A:
The chip features LSI (Large Scale Integration) technology.
Q:Where is this product manufactured?
A:
The product originates from China.
Q:What is the lead time for orders?
A:
The lead time is within 15 workdays for both peak and off-peak seasons.
Q:Is the product available in standard packaging?
A:
Yes, the product comes in standard packaging.
Send Inquiry
*To:Jiangsu Hongxin Semiconductor Technology Co., Ltd
*Content:
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