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High Security Esim Chip Eal6+ Grade for Embedded Communication
US$0.68
1,000 Pieces

Product profile

Customization

Available

Conductive Type

Unipolar Integrated Circuit

Integration

LSI

Model NO.

eSIM chip

Operating Temperature

-20℃+70℃

Shape

Flat

Technics

Semiconductor IC

Transport Package

Standard Packaging

Specification

Standard

Trademark

Original

Origin

China

HS Code

8523529000

Key features

High Security Grade: EAL6+ Grade eSIM Chip for embedded communication security.
Unipolar IC Design: Features Unipolar Integrated Circuit with LSI integration.
Flat Shape Structure: Designed with a flat shape for compact embedding.
Semiconductor Technology: Built using advanced Semiconductor IC techniques.
Standard Packaging: Comes in standard packaging for safe transport.
China Origin: Manufactured in China with original trademark.
Fast Lead Time: Peak and off-peak season lead time within 15 workdays.

Company profile

Importers and ExportersR&D CapabilitiesQA/QC InspectorsHigh Repeat Buyers Choice
Business Type: Manufacturer/Factory, Trading CompanyAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryJiangsu Hongxin Semiconductor Technology Co. is a trade company based in Nantong, China, operating in the manufacturing industry. The company exports diesel engine parts to various global regions and maintains a quality-centric approach. Despite having extensive export experience and a complete industrial chain, the company lacks significant innovation and customization capabilities, with no recent new products or ODM/OEM services for known brands. Financial information is limited, and the company does not demonstrate any strong overseas infrastructure or participation in offline trade shows.
After-Sales capabilityThe supplier emphasizes a customer-centric approach, offering professional after-sales service tailored to diverse needs.
R&D capabilityThe supplier lacks innovation capacity, with no new products or ODM services available in the past year.
Production capacityThe supplier has a high production output of diesel engine parts, indicating strong production capability.
Customization capabilityThe supplier offers customized product solutions for various customer needs.

Product Q&A

Q:What package type is used for this eSIM?
A:
This eSIM chip uses the MFF2 package design.
Q:What is the integration level of the chip?
A:
The chip features LSI (Large Scale Integration) technology.
Q:Where is this product manufactured?
A:
The product originates from China.
Q:What is the lead time for orders?
A:
The lead time is within 15 workdays for both peak and off-peak seasons.
Q:Is the product available in standard packaging?
A:
Yes, the product comes in standard packaging.

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