Integrates five core functions of optical profilometer, image measuring instrument, ultra-DOF microscope, coordinate measuring machine and film thickness gauge.
Supports batch measurement of randomly placed samples without fixtures, manual focusing, manual switching of light sources, lenses or probes.
Comprehensive 3D processing & measurement toolkit: datum plane setting, image denoising, point cloud export, smoothing, height reduction and intensity filtering.
It quantifies profile, volume, area, peak-valley difference, line roughness, surface roughness, flatness and step height.
Widely applicable to consumer electronics, semiconductors, optoelectronics, aerospace, precision molds, new energy, medical devices, watch manufacturing, auto parts, rubberand other industries.
It covers R&D lab testing, mass full inspection and incoming sampling inspection.
One single machine realizes full-dimensional inspection including 2D dimension, 3D height, thickness, positional accuracy, roughness and film thickness.
Software automatically extracts all measurement data into tables, calculates CPK process capability indicators and generates trend fluctuation charts.
Multi-layer images at different heights within a single field of view are automatically focused and fused to generate fully clear depth-synthesized images.