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IC Wafer Grinding Machine High Precision for Semiconductor
US$7,000.00
1 Piece
US$6,500.00
2+ Pieces
Product profile
Customization
AvailableWarranty
1 YearMaterial
CopperModel NO.
BWCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedPower (Kw)
1.5Weight (Kg)
600Machining Accuracy
High PrecisionGrinding Wheel Speed
60 (Rpm)Maximum Grinding Size
110 (mm)Control Method
CNCTransport Package
700*950*1950mmTrademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Grinding: Designed for semiconductor IC wafer grinding with high machining accuracy.
CNC Control System: Features PLC control with variable frequency speed control and electronic preset counter.
Four Pressure Levels: Supports light, medium, heavy pressure, and finishing stages for versatile processing.
Anti-Breakage Design: Upper disc equipped with slow-descent cylinder to prevent breakage of thin workpieces.
Smooth Operation: Driven by AC variable frequency motor ensuring soft start and soft stop.
Customization Options: Supports customization from samples, designs, and flexible minor adjustments.
Diamond Dressing: Compatible with diamond dressing wheels for efficient disc maintenance.
1 Year Warranty: Comprehensive 1-year warranty coverage for mechanical equipment reliability.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤8.57h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period?
A:
We provide a 1-year warranty for this IC Wafer Grinding Machine.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:Can the machine be customized?
A:
Yes, we offer customization from samples, designs, full customization, and flexible minor customization.
Q:What is the lead time for production?
A:
The average lead time is one month, regardless of peak or off-season.
Q:What are the payment terms?
A:
We accept payment via Letter of Credit (LC).
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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