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Likesmile High Efficiency Diamond Wire Saw for Silicon Ingot Slicing
US$7,000.00
1 Piece
US$6,500.00
2+ Pieces
Product profile
Customization
AvailableWarranty
1 YearVoltage
380V50HzModel NO.
BWPower(W)
2 KwCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedWeight (Kg)
2500Surface Roughness
Ra0.8(Um)Electrode Wire Diameter Range
0.7/2.5mmMachine Tool Guide Rail
Steel Guide Rail, Linear Guide RailZ-Axis Travel
500Maximum Load Capacity
600kgMaximum Machining Speed
160(mm/Min)Maximum Power Consumption
2kwTransport Package
700*750*1850Trademark
bwOrigin
Jiangsu, ChinaKey features
High Efficiency Cutting: Specialized equipment for cutting semiconductor single-crystal silicon wafers with high efficiency and stability.
Wide Compatibility: Processes silicon rods compatible with 8-inch and 12-inch wafers up to 450mm length.
Low Silicon Loss: Designed to minimize material waste while ensuring high processing quality.
Comprehensive Warranty: Provides a 3-year warranty period for all mechanical equipment.
Full Customization: Offers full customization, minor customization, and flexible customization options.
PLC Core Component: Features PLC as a core component for precise control and operation.
Quality Inspection: Includes provided machinery test reports and video outgoing-inspection.
ODM Service Available: Supports ODM services with customization from samples and designs.
Product Q&A
Q:What is the warranty period for this machine?
A:
The product has a warranty period of 3 years.
Q:What wafer sizes can this diamond wire saw process?
A:
It can process silicon rods compatible with 8-inch and 12-inch wafers.
Q:What is the maximum processing length?
A:
The maximum processing length is 450mm.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples and designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
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