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Likesmile High Efficiency Diamond Wire Saw for Silicon Ingot Slicing
US$7,000.00
1 Piece
US$6,500.00
2+ Pieces

Product profile

Customization

Available

Warranty

1 Year

Voltage

380V50Hz

Model NO.

BW

Power(W)

2 Kw

Core Components

PLC

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Weight (Kg)

2500

Surface Roughness

Ra0.8(Um)

Electrode Wire Diameter Range

0.7/2.5mm

Machine Tool Guide Rail

Steel Guide Rail, Linear Guide Rail

Z-Axis Travel

500

Maximum Load Capacity

600kg

Maximum Machining Speed

160(mm/Min)

Maximum Power Consumption

2kw

Transport Package

700*750*1850

Trademark

bw

Origin

Jiangsu, China

Key features

High Efficiency Cutting: Specialized equipment for cutting semiconductor single-crystal silicon wafers with high efficiency and stability.
Wide Compatibility: Processes silicon rods compatible with 8-inch and 12-inch wafers up to 450mm length.
Low Silicon Loss: Designed to minimize material waste while ensuring high processing quality.
Comprehensive Warranty: Provides a 3-year warranty period for all mechanical equipment.
Full Customization: Offers full customization, minor customization, and flexible customization options.
PLC Core Component: Features PLC as a core component for precise control and operation.
Quality Inspection: Includes provided machinery test reports and video outgoing-inspection.
ODM Service Available: Supports ODM services with customization from samples and designs.

Product Q&A

Q:What is the warranty period for this machine?
A:
The product has a warranty period of 3 years.
Q:What wafer sizes can this diamond wire saw process?
A:
It can process silicon rods compatible with 8-inch and 12-inch wafers.
Q:What is the maximum processing length?
A:
The maximum processing length is 450mm.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples and designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

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