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Likesmile IC Wafer Edge Grinding Machine Supplier for Semiconductor Industry
US$7,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearApplication
Silicon WafersModel NO.
BWVoltage
380 VCore Components
PLCMachinery Test Report
ProvidedKey Selling Points
AutomaticVideo Outgoing-Inspection
ProvidedPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
1560X700X940mmTrademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Control: Accurate setting of cutting speed, depth, chamfer angle, and surface roughness.
Wide Size Compatibility: Processes various wafer sizes, specifically accommodating 3-6 inch wafers.
Adjustable Grinding Speed: Grinding wheel speed is adjustable from 0-4500rpm with precision control.
Automatic Operation: Semi-automatic operation requiring only manual loading and unloading.
Strong Adhesion Force: Vacuum chuck provides adhesion force better than -80kpa for secure fixing.
Flexible Customization: Offers full customization, minor customization, and flexible customization options.
Low Power Consumption: Energy efficient design with a main motor power of only 2 Kw.
Compact Design: Lightweight structure weighing 350 Kg, suitable for various production lines.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:Can this machine handle different wafer sizes?
A:
Yes, it accommodates wafers ranging from 3 to 6 inches.
Q:Is the machine fully automatic?
A:
No, it is semi-automatic. It requires manual loading and unloading but performs automatic grinding.
Q:What is the maximum grinding speed?
A:
The grinding wheel speed is adjustable up to 4500rpm, and the grinding speed ranges from 1mm/S to 50mm/S.
Q:Do you offer customization services?
A:
Yes, we offer full customization, minor customization, and customization from samples or designs.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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