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Likesmile Semiconductor Silicon Wafer Double Side Lapping Machine Manufacturer
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces

Product profile

Customization

Available

Warranty

1 Year

Type

Double Side Lapping Machine

Model NO.

BW

Voltage

380 V

CNC or Not

CNC

Core Components

PLC

Machinery Test Report

Provided

Power (Kw)

5.5

Weight (Kg)

1800

Machining Accuracy

High Precision

Applicable Industries

Grinding Industry

Installation Method

Floor-Standing

Grinding Wheel Speed

3000(Rpm)

Transport Package

1700*1300*2170(mm)

Trademark

BW

Origin

Jiangsu, China

Key features

High Precision Machining: Equipped with high processing precision for stable operation and accurate results.
Fully Closed-Loop Control: Adopts PLC, grating ruler, and servo control for precise product thickness management.
Integrated Grinding Process: Thinning machine achieves integrated rough grinding and fine grinding in one unit.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
One-Year Warranty: Comes with a standard 1-year warranty coverage for peace of mind.
CNC Technology: Features CNC control with a 5.5 Kw power rating for efficient performance.
Floor-Standing Design: Designed for floor-standing installation suitable for grinding industry applications.
Machinery Test Report: Provides a machinery test report to verify quality and performance standards.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for the Semiconductor Silicon Wafer Double Side Lapping Machine.
Q:Can this machine be customized?
A:
Yes, we offer full customization, minor customization, and flexible customization options based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What is the average lead time for delivery?
A:
The average lead time is one month, regardless of peak or off-peak seasons.
Q:What payment terms are accepted?
A:
We accept LC (Letter of Credit) as the term of payment.

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