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Likesmile Semiconductor Silicon Wafer Double Side Polishing Machine
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableWarranty
1 YearType
Double Side Lapping MachineModel NO.
BWVoltage
380 VCNC or Not
CNCCore Components
PLCMachinery Test Report
ProvidedPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Transport Package
1700*1300*2170(mm)Trademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Processing: Equipped with high processing precision and stable operation for semiconductor silicon wafers.
Fully Closed-Loop Control: Adopts PLC, grating ruler, and servo control for precise product thickness management.
Integrated Grinding Capability: Thinning machine achieves integrated rough grinding and fine grinding in one process.
Flexible Customization Options: Supports customization from samples, designs, full customization, and minor adjustments.
CNC Technology: Features CNC control system for automated and precise machining operations.
1-Year Warranty Coverage: Includes a comprehensive 1-year warranty for mechanical equipment protection.
Complete Production Line Support: Capable of building a complete silicon wafer production line with integrated processes.
Floor-Standing Installation: Designed for floor-standing installation with a weight of 1800 Kg and 3000 Rpm speed.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤7.39h
About Our Factory & Business Background
AddressRoom 704, Building 2, No. 49 Heyan Road, Gulou District, Nanjing City
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for this semiconductor silicon wafer double side polishing machine.
Q:Can the machine be customized?
A:
Yes, we offer flexible customization options including customization from samples, designs, full customization, and minor customization.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the lead times for production?
A:
The average lead time is one month for both peak season and off-season.
Q:What payment terms are accepted?
A:
We accept LC (Letter of Credit) as the term of payment.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
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