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Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine
US$46,000.00-183,500.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
MDHYDS12FATransport Package
Wooden CrateSpecification
1200mm*1600mm*1800mmTrademark
minder-hightechOrigin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
Fully Automatic Operation: Automates wafer loading, alignment, cutting, cleaning, and unloading for improved efficiency.
High-Power Dual Spindles: Equipped with opposed dual-spindles and NCS microscopes to reduce alignment time.
Customizable Dicing Depth: Dicing depth can be customized up to 4mm to meet specific material requirements.
Integrated Cleaning System: Combines cutting and cleaning functions with two-fluid cleaning and wafer drying.
1-Year Warranty Coverage: Includes 1-year warranty for mechanical defects and parts replacement.
Wide Material Compatibility: Suitable for silicon wafers, ceramics, glass, quartz, PCB boards, and more.
Enhanced Automation: Features auto-focus, auto-align, and shape recognition for reduced labor costs.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.03h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period?
A:
We provide a comprehensive 1-year warranty for all our mechanical equipment.
Q:Can the dicing depth be customized?
A:
Yes, the dicing depth can be customized up to 4mm to meet specific processing needs.
Q:What materials can this machine cut?
A:
It is suitable for precision cutting silicon wafers, lithium niobate, ceramics, glass, quartz, alumina, and PCB boards.
Q:What is the maximum workpiece size?
A:
The MDHYDS12B model supports workpieces up to 310*310mm, while the MDHYDS12FA supports up to 420*360mm.
Q:How is quality guaranteed before shipment?
A:
We always produce a pre-production sample before mass production and conduct a final inspection before shipment.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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