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Likesmile Silicon Wafer Chamfering Machine for Clean Edge Processing
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

Automatic Operation: CNC system automatically grinds wafer edges based on preset trajectory and parameters.
Adjustable Grinding Speed: Grinding speed ranges from 1mm/S to 50mm/S with wheel speed up to 4500rpm.
Vacuum Chuck Fixation: Wafer is securely fixed on a vacuum chuck for stable high-speed rotating grinding.
Versatile Wafer Compatibility: Processes various wafer sizes including 3-6 inch wafers and different materials.
1 Year Warranty: Comes with a standard 1-year warranty coverage for the equipment.
Full Customization Available: Offers full customization, minor customization, and customization from samples or designs.
PLC Core Component: Equipped with reliable PLC core components for stable operation.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:Can this machine process different wafer sizes?
A:
Yes, it accommodates wafers of different sizes and materials, specifically 3-6 inch wafers.
Q:Is the machine fully automatic?
A:
It is semi-automatic; manual loading and unloading are required, but the grinding process is fully automatic.
Q:What is the maximum grinding speed?
A:
The grinding speed is adjustable from 1mm/S to 50mm/S, with a wheel speed of 0-4500rpm.
Q:Does the machine support customization?
A:
Yes, full customization, minor customization, and customization from samples or designs are available.

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